According to information relayed by leakers renowned as Digital Chat Station, the Dimensity 9500 would benefit from a brand new architecture, an advanced 3 nm engraving and artificial intelligence performance significantly higher than that of its predecessor, the Dimensity 9400 which equips several smartphones currently available on the market.
The launch of this chip is expected for the last quarter of 2025, probably in October or November, a year after the presentation of the Dimensity 9400. If Mediatek has not yet formalized this information, the consistency of the shared details suggest that the brand is preparing a SOC capable of winning against the Snapdragon of Qualcomm and the Exynos de Samsung. Indeed, the idea would be to offer an innovative approach to the CPU design level and to offer major IA and graphics advances.
An unprecedented CPU architecture for the Dimensity 9500
One of the main novelties of the Dimensity 9500 would lie in its CPU configuration. According to leaks, the chip would adopt an octa-core architecture entirely made up of “big hearts”, thus abandoning the classic scheme of high performance hearts and low-consumption hearts. The distribution would be as follows: a main core Travis (Cortex-X930), three alto cores (also based on Cortex-X930) and four Gelas cores (Cortex-A730).
The Travis heart, considered the most powerful, could reach a frequency greater than 4 GHz, which would represent a significant leap in relation to previous generations. Alto hearts, although less powerful than Travis, are also performance hearts, while gelas ensure the balance between power and energy efficiency. The purpose of this configuration is to offer a homogeneous and constant computing power, adapted to intensive uses such as games, advanced multitasking or AI applications.
For comparison, the Qualcomm Snapdragon 8 Gen 4 and the Exynos 2500 of Samsung also rely on hybrid architectures, but generally retain “small” hearts to optimize consumption in standby. Mediatek thus bet on an “All-Big Core” approach to maximize reactivity and raw power, even if it means betting on software and hardware optimizations to limit heating and consumption.
Between performance and energy compromise
The Dimensity 9500 would be manufactured according to the N3P process of TSMC, an evolution of the N3E used for the Dimensity 9400. This choice would be explained by the will of Mediatek to benefit from a better compromise between performance and energy efficiency, while avoiding the high costs and the limited availability of 2 Nm, reserved in priority for its future SOCs.
The N3P promises an improvement of 5 % of performance and a reduction of 5 to 10 % of consumption compared to the N3E. This could result in increased autonomy and better thermal management for equipped smartphones. However, some observers note that engraving in 3 Nm, although advanced, does not yet fully compete with the promises of 2 nm, but remains interesting progress compared to the previous generation.
-In terms of memory, Dimensity 9500 will support RAM LPDDR5X up to 10,667 Mbps, as well as UFS 4.1 storage on four channels. It is essential for multitasking, gourmet applications and latest generation games.
Advanceds in graphics and artificial intelligence
The graphic component of the Dimensity 9500 would be ensured by an Immortalis-Drage GPU, with a new microarchitecture supposed to improve Ray Tracing performance while reducing energy consumption.
On the artificial intelligence side, Mediatek would incorporate an NPU 9.0 capable of reaching 100 tops (Tera Operations Per Second), or more, or even more, supposed performance of Dimensity 9400. This computing power should allow significant advances in photo processing, real -time translation, voice recognition and on -board machine learning applications. For comparison, Qualcomm also relies on AI in its last chips, but the Dimensity 9500 could, according to advanced figures, take the advantage on this specific point.
The SOC will also have 16 MB of L3 cache and 10 MB of system cache (SLC), against 12 MB for the Dimensity 9400+, which could improve the management of simultaneous tasks and the overall fluidity of the system.
When is this famous new dimensity?
According to several sources, the Mediatek Dimensity 9500 should be formalized in the fall of 2025, probably in October or November, in the continuity of the calendar adopted for previous generations.
The first equipped smartphones could be revealed in stride, with rumors notably evoking an Oppo Find X9 Ultra model. Recall that it is necessary to take this information with caution because, although detailed and overcome by several sources, they remain unofficial to date.
It will be necessary to wait for the formal presentation by Mediatek and the first independent tests to measure the real impact of this new SOC on the high -end smartphones market.
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